The coater enables 2.5D packaging - a next generation semiconductor production technology - to be applied to larger substrates
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Panel Level Coater for Advanced Semiconductor Packaging HONG KONG SAR - Media OutReach Newswire - 9 December 2024 - Toray Engineering Co.,Ltd has developed the "TRENG-PLP Coater", a high-accuracy coating device for panel level packaging (PLP is an advanced semiconductor packaging technology) for ...
The coater enables 2.5D packaging - a next generation semiconductor production technology - to be applied to larger substrates
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