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Maroc Maroc - TECHXPLORE.COM - RSS news feed - 16/Jan 18:05

Low-temperature copper bonding advances next-gen electronics manufacturing

Researchers from the City University of Hong Kong (CityUHK) have achieved a significant breakthrough in electronic packaging technology by developing an innovative nanocrystalline (NC) copper material that enables direct copper-to-copper bonding at lower temperatures. This advancement opens new possibilities for advanced chip design, which is crucial for many next-generation technologies.

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