Imagine a smartphone that can check for spoiled food, detect counterfeit drugs, or even diagnose diseases. This futuristic vision is becoming a...
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Researchers from the City University of Hong Kong (CityUHK) have achieved a significant breakthrough in electronic packaging technology by developing an innovative nanocrystalline (NC) copper material that enables direct copper-to-copper bonding at lower temperatures. This advancement opens new possibilities for advanced chip design, which is crucial for many next-generation technologies.
Imagine a smartphone that can check for spoiled food, detect counterfeit drugs, or even diagnose diseases. This futuristic vision is becoming a...
The Zacks Electronics - Manufacturing Machinery industry participants, such as ENTG, MKSI and ACLS, are benefiting from increased capital spending on...
Researchers have developed a new system that makes delta robots faster and more precise, paving the way for better performance in industries like food...
In the ever-evolving landscape of Australia’s copper tube and wire manufacturing, the sector shines with a promising yet challenging future. As...
Researchers at the University of New South Wales have used a 1 µm copper plating layer on the front silver grid of a TOPCon solar cell to create a...
A breakthrough in wiring material could transform chip technology.
KUALA LUMPUR:The US’ new artificial intelligence ( AI) chip export restrictions are expected to cap the growth potential of electronic manufacturing...
HONG KONG: China’s Country Garden expects to reach terms with creditors next month regarding the restructuring of US$16.4 billion in offshore debt,...
HONG KONG: China’s Country Garden expects to reach terms with creditors next month regarding the restructuring of US$16.4 billion in offshore debt,...